On the fab floor, photoresist bake isn’t optional—it’s a thermal commitment. A 1.5°C drift across the wafer is enough to turn critical linewidths into yield slipping away. We built the Modular Infrared Heating Array to live with that reality, delivering repeatable, measurable control because that’s what the process demands. What matters, technically The array uses near-infrared emitters in a modular layout, so you can match the heated zone to the process window—full-wafer or die-level. Temperature uniformity holds at ±0.1°C across the active area, and setpoint stability stays tight even when the load changes. Cleanroom compatibility is built in: Class 1–100 operation with zero particle generation, and surfaces that support low-outgassing polymer processing. Soft bake and hard bake profiles run with strict thermal budget control, keeping critical dimension integrity across lots. In lithography and packaging, repeatable heat is the fastest route to stable yield. The modular design drops into existing coat/bake tracks and reflow stations without forcing a full hot-zone requalification, so changeovers are quicker. Energy use comes down because NIR heats the target directly, not the air around it. Uptime is the real reliability metric. Units run 24/7 without unplanned downtime tied to hot-zone wear, and the emitters hold output over long campaigns. That means bake profiles stay consistent—first wafer to last. Here are the practical details. The array needs precise optical alignment and a clean, dry cooling supply to keep the thermal envelope intact. The footprint is compact, so plan the mechanical envelope early; once the modular stack is in place, there isn’t much room for field rework. When the interface is handled right, you get process-ready heat with the repeatability your QC program counts on.