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		<title>CMP on Infrared Heating Applications</title>
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				<title>CMP后晶圆干燥加热器</title>
				<link>http://ir-heating-case.com/zh/posts/post-cmp-wafer-drying-heater/</link>
				<pubDate>Thu, 02 Jul 2026 09:27:37 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heating-case.com/images/016cf4f616aaa15e4af48856b8adc51b.png&#34; alt=&#34;CMP后晶圆干燥加热器&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;在光刻后处理阶段，从浆液处理工序中出来的晶圆上，其图案区域仍带有微小的液滴。这样的晶圆实际上已经具备了合格品的条件。而水痕、重新沉积物以及图案变形等问题则通常会在后续的光刻和蚀刻工序中出现。因此，干燥装置并非可有可无的部件，而是晶圆离开CMP处理单元前的最后一道热处理步骤。&lt;/p&gt;</description>
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